| 1. | Materials for interconnection structures - sectional specification set for conductive foils and films with and without coatings - conductive inks
内部连接结构材料.有或无涂层的导电箔和导电膜分规范.导电墨水 |
| 2. | Materials for interconnection structures . part 5 : sectional specification set for conductive foils and films with or without coatings . section 4 : conductive inks
互连结构用材料.第5部分:有涂层或无涂层的导电箔和薄膜的分规范集.第4节:导电油墨 |
| 3. | Materials for interconnection structures - part 5 : sectional specification set for conductive foils and films with or without coatings - section 4 : conductive inks
内部连接结构用材料.第5部分:有或无涂层的导电箔和导电薄膜分规范.第4节:导电墨水 |
| 4. | Materials for interconnection structures - sectional specification set for conductive foils and films with and without coatings - copper foils for the manufacture of copper - clad base materials
连接结构用材料.第5部分:带和不带覆层的导电箔和薄膜的分规范.第1节:铜箔 |
| 5. | Materials for interconnection structures - part 5 : sectional specification set for conductive foils and films with or without coatings ; section 4 : conductive inks iec 61249 - 5 - 4 : 1996 ; german version en 61249 - 5 - 4 : 1996
连接结构材料.第5部分:带或不带涂层的导电箔和薄膜分 |
| 6. | Materials for interconnection structures - part 5 : sectional specification set for conductive foils and films with and without coatings - section 1 : copper foils for the manufacture of copper - clad base materials
连接结构用材料.第5部分:带和不带涂层的导电箔和薄膜的分规范.第1节:铜箔 |
| 7. | Materials for interconnection structures . part 5 : sectional specification set for conductive foils and films with and without coatings . section 1 : copper foils for the manufacture of copper - clad base materials
互连结构用材料.第5部分:有涂层和无涂层的导电箔和薄膜的分规范集.第1节:铜箔 |
